Rutronik supports Team HCB-Rutronik Racing in the Macau GP




Hong Kong, China, October 30, 2017 /ChinaNewswire.com/ - Rutronik Elektronische Bauelemente GmbH plans to broaden its business relationships in Asia and become better known in this growth market. To this end, Rutronik will be the main sponsor for Team HCB-Rutronik Racing from Wilferdingen at the FIA Grand Prix in Macau together with its partners Yageo and Vishay. The event will take place from Thursday, 16 November until Sunday, 19 November. Team HCB-Rutronik Racing will also be receiving support from Audi Sport customer racing.

“Without our powerful partners Yageo, Vishay and Audi Sport customer racing, we would not be able to engage in this degree of commitment in Macau,” says Rutronik CEO Thomas Rudel. As a team, the partners pulled off a real coup: Team HCB-Rutronik Racing’s No. 1 driver behind the wheel of one of the two Audi R8 LMS is none other than the current Formula E world champion Lucas di Grassi. CEO Rudel explains how engaging the Brazilian has a strategic significance that goes beyond the sporting success: “Lucas di Grassi is the Formula E world champion. But he is also an entrepreneur and owner of a company that manufactures innovative e-bikes. Motor sports know-how is one of the ingredients that contributes to the production processes. This means that di Grassi embodies Rutronik’s philosophy as a highly innovative, flexible and dynamic company.”

Initial exchanges between di Grassi and the distributor have already taken place, and Rutronik is interested in intensifying this cooperation. CEO Rudel can also imagine further cooperation with Roborace, the world’s first driverless motor sports platform of which di Grassi is the CEO. The automotive sector is one of Rutronik’s most important business areas; the electronic component distributor achieves over 40% of its turnover in this area. This means the company can make a correspondingly weighty contribution in terms of its expertise and providing access to the latest components.

The company intends to use the Macau Grand Prix as a platform for intensifying its business relationships with important partners including co-sponsors Yageo and Vishay, as well as strengthening its profile on the Asian market in general. In 2016, when Rutronik was main sponsor for HCB-Rutronik Racing in Macau for the first time, 87 TV stations and over 900 radio stations from all over the world reported on the GP, not to mention worldwide streaming services and around 400,000 enthusiastic fans at the event itself.

The world champion‘s optimism

“For me, Macau is one of the most difficult races in the world,” says Lucas di Grassi. “I have already raced here twice in Formula 3 and am very much looking forward to returning. What interests me especially is getting to know the course as an Audi works driver with a GT vehicle. HCB-Rutronik Racing is a highly professional team, and I think we have a good chance of winning the race. That is definitely my aim. The contact with Rutronik also came via HCB, and I am really looking forward to further cooperation in future.” The second HCBRutronik Racing cockpit will be occupied by Fabian Plentz, as was the case last year. This year, HCB-Rutronik Racing is receiving works support from Audi Sport customer racing.

Macau as a factor in Rutronik‘s Asia strategy

The Macau Grand Prix is regarded as being one of the most important motor sport events of the racing year. Since 1954, several Formula 1 drivers have raced in the GP. The winners include Ayrton Senna, Michael and Ralf Schumacher as well as David Coulthard. The GT World Cup in which HCB-Rutronik Racing is taking part has been held since 2008.

“Asia is a huge growth market for Rutronik, and the Macau Grand Prix is one of the largest motor sport events in the world,” as Markus Krieg, Rutronik’s Managing Director for marketing, points out. “Motor racing has to be able to rely on extremely high-quality electronic components that can cope with the most demanding of situations. So from the entrepreneurial point of view, being present at such a high-profile race represents the perfect opportunity for Rutronik to position itself as a technologically competent and reliable partner for local, regional and global customers.” Currently, Rutronik has three offices in China – in Shanghai, Shenzhen and Chengdu – as well as subsidiaries in Hong Kong, Taiwan, Singapore and Thailand.

To watch the race live, please follow this link:
http://www.macau.grandprix.gov.mo/gp/64/home/index.php?lang=en

About Rutronik (www.rutronik.com)

Rutronik Elektronische Bauelemente GmbH is the third largest distributor in Europe (European Distribution Report 2016) and the number ten worldwide (SourceToday, May 2017). The broadline distributor supplies semiconductors, passive and electromechanical components as well as boards, storage, displays wireless products. The company's primary target markets are the automotive, medical, industrial, home appliance, energy and lighting industries. The ranges RUTRONIK EMBEDDED, RUTRONIK SMART, RUTRONIK POWER and RUTRONIK AUTOMOTIVE provide customers with specific products and services in groups tailored to the respective applications. Expert technical support for product development and design-in, individual logistics and supply chain management solutions as well as comprehensive services complete its scope of performance.

The company, founded by Helmut Rudel in 1973 in Ispringen, Germany, now has over 70 subsidiaries in Europe, Asia and the Americas. Rutronik employs more than 1,600 staff worldwide and achieved Group sales of 872 million euros in the fiscal year 2016.

Source: ChinaNewswire.com

思创聚氨酯树脂风机叶片通过静力和疲劳试验

创新材料通过测试,预示着更轻质更高效风机叶片时代即将到来

中国上海 2017年10月30日 /ChinaNewswire.com/ 全球领先的高性能聚合物材料供应商科思创宣布,基于科思创创新技术研发的聚氨酯风机叶片,成功通过北京鉴衡认证中心(CGC)的静力和疲劳测试(包括摆振和挥舞方向)。在2017北京国际风能大会暨展览会上,科思创公布了这一喜讯,并向观众展示了其全新聚氨酯树脂解决方案。

此次通过测试的风机叶片功率为2兆瓦,长度为55.2米,其大梁和腹板采用科思创的新型聚氨酯灌注树脂和重庆国际复合材料有限公司的TM+ 玻璃纤维制成,叶片的其他部分仍然使用环氧树脂制造。

在叶片的设计、生产制造和测试等环节,科思创与德国叶片设计公司WINDnovation、洛阳双瑞风电叶片有限公司以及北京鉴衡认证中心通力协作,为成功通过叶片测试奠定了坚实的基础。

科思创聚氨酯事业部亚太区研发总监李倩博士说道:“风机叶片测试是证明叶片长期可靠运行的关键。测试结果表明,聚氨酯树脂可以达到严格的行业标准,满足叶片在恶劣条件下的长期使用要求,这是继科思创聚氨酯材料获得DNV GL国际认证之后又一个里程碑。同时,本次测试也充分证明,聚氨酯与环氧树脂之间有着很强的界面结合力。”

使用聚氨酯实现更轻更强的叶片

凭借一系列性能上的优势,聚氨酯使得制造更轻更强的叶片成为可能。更轻质、更高效的叶片可显著减少对风力发电机组轮毂部件和塔架结构的需求,从而降低风机的整体投资和运营成本。

聚氨酯和玻璃纤维之间的界面性能优于环氧树脂。材料具有更出色的机械性能和优异的抗疲劳性能,通过优化叶片设计,在轻量化叶片设计上具有明显的优势。

同时,聚氨酯树脂具有比环氧树脂更低的粘度和更好的流动性,可以节省灌注时间,提高灌注效率。而且,聚氨酯树脂无需后固化,可以大大缩短生产时间。除此之外,聚氨酯树脂的放热峰也低于环氧树脂,从而可以降低树脂放热对PVC泡沫芯材的影响。

推动风力革命

作为一种创新材料,聚氨酯树脂有助于打造更轻更强的风机叶片,从而推动风力发电行业发展。未来,中国将在低风速的中东部地区建设更多风电产能,这意味着需要更高的塔筒和更长的叶片来有效捕获速度较低的风力,以此提高发电效率。此外,海上风电正快速发展成为风电行业的重要发展趋势。在大型叶片上的应用,可以更好的发挥聚氨酯树脂的优异性能。

支持可再生能源发电是科思创可持续发展理念的重要组成部分。长期以来,科思创始终致力于推动风力发电这一潜力巨大的可再生能源的发展。作为风能聚氨酯应用领域的先驱,科思创开发了用于风轮叶片的双组分聚氨酯配重材料、用于塔筒和叶片的聚氨酯涂料体系以及用于风机海底电缆的聚氨酯弹性体。科思创的聚氨酯解决方案彰显了公司对风电行业合作伙伴的长期承诺——加快创新,携手推动风电行业发展。

关于科思创:

科思创是全球最大的聚合物生产公司之一,其2016年度销售额达到119亿欧元。其业务范围主要集中在高科技聚合物材料的生产制造及用于诸多日常生活领域的创新性解决方案的研发。主要服务行业涵盖汽车、建筑、木材加工和家具、电气和电子、体育休闲、化妆品、医疗以及化工行业本身。科思创前身为拜耳材料科技,截至2016年底,在全球拥有30家生产基地、约15600位员工(按全职员工计算)。

本新闻稿刊登在科思创公司的新闻服务器上,可供下载,网址为www.covestro.com。在该网址上也可以下载图片材料。请标明资料出处。

欲了解更多信息,请访问www.covestro.com

前瞻性声明
本新闻稿包括科思创股份公司基于当前设想和预测所做的前瞻性声明。各种已知和未知风险、不确定性和其它因素均可能导致公司未来的实际运营结果、财务状况、发展或业绩与上述前瞻性表述中所作出的估计产生实质性差异。这些因素包括在科思创官方网站www.covestro.com上公开的科思创各项报告。本公司不承担更新这些前瞻性声明或使其符合未来事件或发展的责任。






Source: Covestro

Ingenico Introduces AI-Powered Zero Fraud Solution




Hong Kong, China, October 30, 2017 /ChinaNewswire.com/ - Ingenico Group, the global leader in seamless payment, announced that it has expanded its fraud detection and management capabilities with a new, real time solution that enables merchants to increase revenue by optimizing their acceptance rate and reduce customer churn. The new solution leverages sophisticated Artificial Intelligence (AI) technology developed by the German-Israeli payment security company Fraugster to identify and separate fraudulent transactions from legitimate ones. This enables a new fraud protection insurance model, which means fraud is reduced to zero for merchants. If any fraudulent transactions slip through the solution, the costs are absorbed by Fraugster. As the solution is fully integrated into Ingenico’s platform, adding the fraud solution is simple and only requires one click activation with no additional technical implementation on the side of the merchant.

As the total global eCommerce market continues to grow, so do the costs associated with online fraud and chargebacks. This is particularly true for international merchants, because cross-border payments have significantly higher risk of fraud than domestic payments do. Increasingly, sophisticated cyber criminals also take advantage of the shift to mobile payments, where fraud losses are higher as percentage of revenue. In addition to monetary losses, online fraud also brings with it the risk of potentially severe reputation damage. Consumers are less inclined to shop at merchants that have been associated with fraud. Yet merchants who implement overly strict fraud rules risk rejecting legitimate customers, leading to further monetary and reputation loss.

As a global Payment Service Provider, Ingenico not only processes online and mobile payments, but also provides value-added services to further optimize merchants’ financial flow. The new fraud solution offers merchants a choice of two products that each target a side of the risk management coin.

#8226; The Fraud Free Product: Made for merchants who have a chargeback problem. This product covers CNP losses for merchants who have high chargeback rates.

#8226; The new Fraud Free+: Made for merchants who have an acceptance rate problem. This product not only covers merchant’s chargeback losses but also increases their acceptance rates and revenue by accepting more good customers.

Automated risk management and reporting provide transparency as well as instant, detailed feedback on performance – allowing in-house risk teams to focus on other tasks.

“Fraud is a fact of life for online merchants, but that doesn’t mean they have to just accept it. At Ingenico, we reduce exposure to fraud to a minimum with efficient tooling and expertise,” said Gabriel de Montessus, VP Retail Global Product and Marketing for Ingenico Group. “Artificial Intelligence is the future of fraud prevention, and this solution will help our merchants improve their performance.”

“This partnership combines Fraugster’s innovative technology and disruptive vision with Ingenico’s experience, global merchant portfolio and ability to execute at scale,” said Max Laemmle, CEO and founder of Fraugster. “Independently, we each have a piece of the puzzle. Together, we will take that next step and reduce online fraud to zero for merchants.”

To help merchants understand the true cost of fraud and address common questions about the use of AI in fraud prevention strategies, Ingenico and Fraugster developed a comprehensive report that can be downloaded free of charge at https://www.ingenico.com/press/fraugster

About Ingenico Group
Ingenico Group (Euronext: FR0000125346 – ING) is the global leader in seamless payment, providing smart, trusted and secure solutions to empower commerce across all channels, in-store, online and mobile. With the world’s largest payment acceptance network, we deliver secure payment solutions with a local, national and international scope. We are the trusted world-class partner for financial institutions and retailers, from small merchants to several of the world’s best known global brands. Our solutions enable merchants to simplify payment and deliver their brand promise.
www.ingenico.com twitter.com/ingenico

About Fraugster
Fraugster Ltd. Is a German-Israeli payment security company leading the future of fraud prevention with Artificial Intelligence. With the vision to create a fraud free world, we have designed and built a proprietary Artificial Intelligence technology that not only eliminates payment fraud but also maximizes revenues for e-commcerce merchants. We have been operating across the globe since 2016 and are currently responsible for tens of billions of dollars for our clients. Our products are used and trusted internationally by leading payment companies.
www.fraugster.com twitter.com/fraugster

Source: ChinaNewswire.com

直击生命科技年度盛典 莱馥全面领跑“产学研用资”




中国上海 2017年10月30日 /ChinaNewswire.com/ 10月28日,由莱馥生命科技承办的2017年手术与细胞治疗学术委员会成立暨全国首届学术研讨会在上海陆家嘴金茂大厦隆重举行。

来自上海现代服务业联合会、上海市公共卫生临床中心、中国科学院、卫计委、食品药品监督管理总局等多个部门和单位的相关领导,国内生物学界著名学者与知名临床医生及资本界代表等出席。会议主要探讨了细胞治疗领域里前沿研究和临床应用的结合,以及金融资本推进成熟临床项目的产业化进程。该学术委员会的成立标志着我国细胞治疗领域,“产学研用资”相结合的行业专业交流平台的形成。同时,大会的召开对促进细胞治疗研究、临床应用转化、及相关产业的跨越发展有着重要意义,堪称一场生命科技的年度盛典。

突破性实现两个跨界对话

此次会议内容丰富,亮点纷呈,为大家带来了一场思想盛宴和学术大餐。全天共呈现了包括中国科学院院士吴祖泽等30多个细胞行业专家学术报告,两场主题高峰对话,并突破性的实现了“前沿研究与临床应用”、“细胞产业与金融资本”两个跨界对话,碰撞出思想与智慧的耀眼火花。这是一场前沿研究与临床应用的亲密接触,这是一次金融资本与细胞产业的世纪之吻。

细胞治疗前景广阔

出席会议的嘉宾,前上海市副市长、现上海现代服务业联合会会长周禹鹏表示,作为国家卫生和计划生育委员会旗下的学术分会,手术与细胞治疗学术委员会的成立增长了我国新兴科技的力量,同时,对于国家十三五发展规划纲要提出的,把精准医疗和细胞治疗作为重点发展规划也是一种积极的响应。

会上,中国科学院院士、莱馥生命科技首席科学家吴祖泽,就《细胞治疗和再生医学的未来》发表重要学术报告。吴祖泽院士指出,相对于药物治疗,细胞治疗具有高精准、强疗效、毒副作用少,治疗范围广等优点。随着技术的逐步突破以及行业的深入发展,细胞治疗和再生医学的未来将会非常广阔。

金融资本推动行业发展

10月28日上午,会议除了细胞治疗研究专家、临床应用专家医师和金融资本从业人员的学术报告外,还精心设置了以“中国的细胞产业如何在国际化竞争中弯道超车脱颖而出”、“细胞治疗平台化战略实施价值”为题的对话。高峰对话由上海莱馥生命科技EVP周继人先生主持进行,参与这个环节的嘉宾有(下图由左至右依次为)复旦大学上海医学院外科学系主任蔡端教授、手术与细胞治疗学术委员会主任委员刘保池教授、北科集团总裁叶圣勤先生、上海莱馥生命科技有限公司董事长&CEO陈宝雯女士、细胞治疗与再生医学产业化资本联盟理事许骏先生以及美敦力柯惠医疗器材制造(上海)有限公司总经理王艳女士,深入解读和探讨了金融资本布局细胞产业,推动成熟细胞治疗项目的产业化发展方式和意义。

莱馥生命科技董事长&CEO陈宝雯女士指出,以基因和细胞技术为主的精准医学和再生医学将引领预防与治疗疾病的革命性突破,开启新一轮60年的大产业周期!在国家大力推动精准医疗和细胞治疗的大背景下,从2017年起,相关产业政策有望逐步放开,金融资本与细胞治疗的产业化联动将会有更大的想象空间。产业资本的注入对尖端细胞治疗技术从实验室研究到临床应用,再到商业化生产的转化起到推动和催化作用。

专家学者联动共享科技发现

10月28日下午,会议分别在两个会议室进行,来自全国细胞治疗领域的专家学者就化疗前后自体骨髓回输、CAR-T细胞治疗、脐血CIK移植、脂肪间充质干细胞转化、干细胞移植治疗、人体干细胞临床应用、骨髓移植治疗、干细胞的功能应用等热点领域进行了交流探讨,共享了生命科技的伟大发现。

最后,大会现场还一同见证了细胞治疗与再生医学产业化资本联盟的成立,联盟是专门面向临床的研究基金,将实现细胞产业与资本的无缝对接,促进干细胞与再生医学技术创新、成果转化和产业发展,助推上海建设具有全球影响力的科创中心。

本次会议诸多研究方向专家学者的学术报告,让参会者受益匪浅。手术与细胞治疗学术委员会的成立为后续的细胞治疗研究、应用及产业化提供了诸多可行的办法,拓宽了细胞产业的发展思路。莱馥生命科技作为本次会议的承办方,无论在会议的策划实施,还是在会议探讨的“产学研用资”领域,都取得了巨大成功,成为了名副其实的行业领跑者。






Source: Lai Fu

HMD Global Presents Nokia 5 Smartphone and Retro Nokia 3310 3G




Hong Kong, China, October 27, 2017 /ChinaNewswire.com/ - Hong Kong, October 25, 2017 – HMD Global, the home of Nokia phones, today announced the launch of the Nokia 5 smartphone and the iconic Nokia 3310 3G, two different models to meet unique needs of users. Always striving to deliver the best possible smartphone experience, Nokia mobiles provides compelling experiences for consumers, and aim to set a new standard in design, material quality, and manufacturing innovation.

Nokia 5: Sleek curved design
With a sleek and compact body, Nokia 5 has been precisely engineered out of a single block of 6000 series aluminium to create a perfect pillowed body that flows seamlessly into the sculpted 2.5D Corning#174; Gorilla#174; Glass. Powered by Qualcomm#174; Snapdragon#8482; 430 processor and Qualcomm#174; Adreno#8482; 505 graphics processor, the Nokia 5 brings robust structural integrity, attention to detail, and the quality of a high-end flagship to consumer. Nokia 5 comes with three card slots, supporting dual-SIM cards and micro SD card and will be available in two colours: Black and Silver to cater to user preferences at the suggested retail price of HKD 1,388.

Nokia smartphones offer a simple and flawless experience along with the periodic Android operating system updates. The latest system also supports Android’s Doze that helps to reduce battery consumption when users are not using their phone. Nokia 5 also features Google Assistance – so that with a simple voice command, you can run a search, schedule meetings, get accurate traffic updates and more – providing an all-around exceptional experience.

Nokia 3310 3G: A modern classic reimagined
Featuring distinctive colours and a brand new user interface, the Nokia 3310 3G offers users personlisation based on their personalities. It not only presents a perfect blend of modernity and nostalgia, the classic Nokia game Snake also comes pre-installed on the phone. The interface has been improved to deliver an enhanced experience, meaning that you can now change the icon colours and position to ensure your favourite functions are exactly where you want them to be.

Nokia 3310 3G version comes with new silver keypads and a curved ergonomic body, allowing more spacing between the buttons, enabling users to dial, text, and use social media more comfortably. Nokia 3310 3G has up to 6.5 hours of talk time and up to 27 days of standby time so you are always able to stay in touch. Also, the Nokia 3310 3G will be available in two popular colours: Charcoal and Warm Red, and will be available at a suggested retail price of HKD 568.

“We are excited to bring Nokia 5 and also the long-awaited Nokia 3310 3G for our Hong Kong users. Both models continue our mission to connect people with our design philosophy and commitment of providing an enhanced mobile experience,” said Sancho Chak, General Manager of Taiwan, Hong Kong and Macau of HMD Global. “Combine all of that with intricate designs and our consistent effort to optimize the smartphone experience, we hope to empower users to live a better life.”

Sales for Nokia 5 and Nokia 3310 3G will be available from November 3 at:
#8226; Nokia 5: csl., 1O1O under CSL Mobile Limited, Telecom Digital, SUN Mobile, Broadway, Fortress and Wilson Communications (in no particular order)
#8226; Nokia 3310 3G: csl., 1O1O under CSL Mobile Limited, Broadway, Fortress, Wilson Communications and all Nokia phone authorized retailers (in no particular order)

High-resolution photos can be downloaded from the link here (https://goo.gl/kPzhma).

###

About HMD Global
Headquartered in Espoo, Finland, HMD Global Oy is the home of Nokia phones. HMD designs and markets a range of smartphones and feature phones targeted at a range of consumers and price points. With a commitment to innovation and quality, HMD is the proud exclusive licensee of the Nokia brand for phones and tablets. For further information, see www.hmdglobal.com.

For media enquiries, please contact:
The Hoffman Agency (www.hoffman.com)
Grace Chu
Tel: 2231 8109/ 6902 5092
Email: [email protected]

Gladys Chow
Tel: 2231 8115/ 9270 3212
Email: [email protected]

Source: ChinaNewswire.com

中金投网创始团队任命资深出版人万锘薇担任董事合伙人




香港 2017年10月26日 /ChinaNewswire.com/ 专注于中国风投科技行业的领先双语资讯平台中金投网China Money Network)创始人向冀女士今日宣布一项公司创始团队重要任命。

资深出版人万锘薇(Naveet McMahon)将加盟中金投网担任董事合伙人,并成为公司创始团队的重要一员,该任命自今年10月26日起生效。她将负责领导公司业务拓展策略,带领公司团队迅速提升国际国内影响力,打造聚焦中外跨境资本和创新的一站式双语资讯平台。

“我们热烈欢迎万锘薇女士加入中金投网。凭借她在亚太地区金融信息与资讯行业近二十年的深厚背景,相信她的加入将帮助公司上升到新高度,未来取得更多引人瞩目的成绩,”中金投网联合创始人向冀女士表示。

加盟中金投网之前,万锘薇女士曾在并购市场资讯公司Acuris(前称Mergermarket Group)旗下出版与会议子公司Remark担任亚太区销售总监与发行人。更早以前,她曾在Haymarket集团旗下FinanceAsia与欧洲货币机构投资者集团(Euromoney Institutional Investor PLC)旗下Euroweek担任管理职务,常驻香港。

对于此次任命,万锘薇表示:“我非常兴奋加入中金投网,一家依托前沿人工智能科技的新一代多媒体资讯公司,也很期待与团队一起开发新的服务及产品。我将发挥自己在亚洲地区的金融信息研究与营销战略经验,帮助客户定制和打造超乎其它平台的特色创新解决方案。”

与此同时,中金投网宣布三位行业顶级专家已经加入公司的顾问团,他们是:国际金融咨询集团Rothschild澳大利亚分公司董事长(原执行总裁)Trevor Rowe;中国在线旅游搜索引擎去哪儿网联合创始人Fritz Demopoulos;和中国风险投资公司阿米巴资本创始人赵鸿。

 

关于中金投网
中金投网(China Money Network)创办于2011年,是一家领先的专注于大中华区风投科技的双语资讯平台,实时追踪中国私募、风投、科创方面的实用数据,致力于搭建中外商业创新信息互通的桥梁,为全球专业人士提供独特投资视野及关键决策的资讯和数据。

中金投网的核心产品包括中英文资讯平台www.chinamoneynetwork.comwww.zhongguojinrongtouziwang.com,以及有关中国私募风投基金、企业、投融交易的实时数据库。其它增值服务包括:客制化市场报告、金融播客、短视频、年度排行与奖项、高端线下社交活动等。

目前,中金投网是一家独立运营公司,总部位于中国香港,并在上海、北京、深圳、杭州、美国洛杉矶等地设有办公室。公司股权目前由创始团队成员及员工共同持有。

关注我们:
新浪微博@中金投网,微信公众号@中金投网CMN

欲了解更多详细信息,请电邮[email protected]






Source: China Money Network

China Money Network Announces Accomplished Publisher Naveet McMahon Has Joined The Fast-Growing Tech Company As Managing Partner



With nearly 20 years of Greater China media experience, Ms. McMahon is a highly respected executive in the media and tech sector.

Hong Kong, China, October 26, 2017 /ChinaNewswire.com/ - Nina Xiang, Managing Editor and Founder of China Money Network Limited, the artificial intelligence (AI)-powered platform tracking China’s smart investments and technology innovation, today announced an important new addition to the company's founding team.

Naveet McMahon, will be joining CMN as managing partner and part of the company's founding team, with effect from October 26, 2017. She will play a leading role in CMN’s overall business development strategy and accelerate the company's expanding presence globally, with the aim to making CMN the go-to source for cross-border investment opportunities in China using its bilingual data intelligence.

”We are extremely pleased to welcome Naveet McMahon on board given her reputation and experience doing business within the Asia Pacific region," says Nina Xiang, founder and managing editor of CMN. "With Naveet's extensive knowledge in the financial and data intelligence industry, we are confident that she is the right person to lead CMN to new heights."

Before joining CMN, Ms. McMahon was the Publisher and Director of Sales, Asia-Pacific at Remark, the market research and events division of Acuris, formerly Mergermarket Group. Prior to that, she held management roles at both FinanceAsia under the Haymarket Group and Euroweek at Euromoney Institutional Investor based in Hong Kong.

Commenting on the move, Ms. McMahon says: "I'm looking forward to working closely with the CMN team of experts to develop new products and manage a new-generation information portal powered by the latest cutting-edge AI technology. By leveraging my experience in financial bespoke research and marketing strategies in Asia Pacific, I believe we can offer unparalleled innovative solutions, ahead of other data sources."

At the same time, CMN announces that the company has expanded their team of advisors consisting of some of the industries top experts from the region. They include: Trevor Rowe, AO, Chairman (formerly Executive Chairman) of Rothschild Australia Limited; Fritz Demopoulos, co-founder of Chinese online travel search engine Qunar.com; and Andrew Toeh, founder of Chinese venture capital firm Ameba Capital.

 

ABOUT CHINA MONEY NETWORK:
Founded in 2011, CMN connects the data points to give investors the tools to execute deals in China and beyond. By tracking forward-looking private equity, venture capital and technology innovation we deliver immediately usable data.

CMN's core products include bilingual platforms www.chinamoneynetwork.com and www.zhongguojinrongtouziwang.com, innovative databank on China's cross-border deal, private equity, venture capital and technology innovation. Other services include: customized market research, podcasts, videos, rankings, awards and bespoke events.

CMN is headquartered in Hong Kong and operates from offices in Shanghai, Beijing, Shenzhen, Hangzhou and Los Angeles. We are an independent business owned by our founding team and employees.




Source: China Money Network

Molex Signs Distribution and Technology Agreement with Electronic Systems Technology, Inc.




Hong Kong, China, October 26, 2017 /ChinaNewswire.com/ - Molex and Electronic Systems Technology, Inc. (EST) dba ESTeem Wireless Modems, manufacturer of the ESTeem#8482; product line of narrow-band licensed, Ethernet-licensed and unlicensed wireless modems, have signed a Master Goods Agreement that allows Molex to sell EST’s full product line as well as integrate ESTeem technology into Molex products. This distribution agreement expands the Molex wireless communications offering and gives customers access to a broader range of solutions.

“This agreement with EST allows Molex to offer the complete spectrum of industrial wireless communications hardware, giving customers access to best-of-breed products while simplifying their supply base all through one provider,” said Chuck Clark, industrial channel manager, Molex. “EST has been an industry leader on the wireless modem for more than 30 years, and our customers will benefit from EST’s diligent efforts to continually enhance its products.”

ESTeem Wireless Modems provide proven and reliable wireless solutions for the industrial control, public safety and federal markets. In addition to its high-speed wireless Ethernet modems, EST also produces licensed, narrow-band radios in the VHF and UHF communication bands with both Ethernet and serial interfaces for applications not served by conventional communications systems.

“We are very excited about the additional market access that this agreement with Molex will open up for our products,” said Mike Eller, president, EST. “Through this reselling arrangement, Molex will be able to expose our wireless modem technology to a broader range of customers and help them meet a more complex set of challenges.”

For more information about Molex product offerings, please visit www.molex.com.

About Electronic Systems Technology, Inc.

For over 30 years, Electronic Systems Technology, Inc. has specialized in the development and manufacturing of digital data (non-voice) radio transceivers for use in industrial wireless networking applications. With reliance on wireless communication in the modern world, the global modernization of industrial control systems now require the benefits gained by use of wireless technology. EST designs and produces these specialized, hardened products to operate and survive in these difficult conditions.

EST designs, develops, manufactures and markets the ESTeem line of industrial wireless products and accessories. EST’s products provide innovative communication solutions for applications not served or underutilized by conventional, commercial grade communication systems. EST’s products are part of the ESTeem Industrial Wireless Solutions for commercial, industrial, and government arenas both domestically and internationally. EST’s products are marketed through direct sales, sales representatives, and resellers.

About Molex:

Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive, commercial vehicle. For more information, please visit www.molex.com.

Molex Resources:

#8226; Learn more about Molex at www.molex.com
#8226; Follow us at www.twitter.com/molexconnectors
#8226; Watch our videos at www.youtube.com/molexconnectors
#8226; Connect with us at www.facebook.com/molexconnectors
#8226; Read our blog at www.connector.com

Source: ChinaNewswire.com

Microsemi Announces Availability of its RTG4 High-Speed, Radiation-Tolerant FPGA Engineering Samples in a Ceramic Quad Flat Package for Easier Integration and Qualification of Flight Systems




Hong Kong, China, October 26, 2017 /ChinaNewswire.com/ - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced its RTG4#8482; high-speed signal processing radiation-tolerant field programmable gate array (FPGA) engineering samples in a ceramic quad flat pack (CQFP) package are now available. The new CQ352 package, which conforms to the CQFP industry standard for space applications, features 352 pins to enable a more cost-effective integration than higher pin count packages and is the only CQFP package available for high-speed radiation-tolerant FPGAs in its class.

As an industry standard, the CQFP package is well-known for its ability to support a variety of space flight applications, primarily due to their lower costs of integration and well-understood assembly techniques, making CQFP easier to assemble onto the printed circuit board (PCB) than ceramic column grid array (CCGA) packages. As a result, CQFP is widely respected by space customers worldwide, including its meticulous package assembly, inspection and testing processes.

“We are excited to bring one of the most popular package types for space flight applications to Microsemi’s RTG4 FPGA family and provide customers a more cost-effective integration than higher pin count packages,” said Minh Nguyen, senior marketing manager for space at Microsemi. “This addition to our existing CG1657 package not only enhances the overall packaging portfolio for these devices, but also demonstrates our ongoing commitment to delivering innovative solutions which enable customers to confidently evaluate and design while meeting demanding industry specifications.”

The RTG4 FPGA in a CQ352 package is ideally suited to control applications which do not require a high number of inputs/outputs (I/Os), including satellites, space launch vehicles, planetary orbiters and landers and deep space probes, as well as others requiring frequent switching and a high number of temperature cycles, which can be challenging for CCGA packages. According to Euroconsult’s report titled, “Satellites to be Built and Launched by 2024,” 60 percent more satellites will be launched by 2024 versus the past decade. This increase is driven primarily by civilian government agencies as established space countries replace and expand their in-orbit satellite systems and more countries acquire their first operational satellite systems.

Microsemi’s RTG4 FPGA in the CQ352 package features 166 3.3V general purpose I/Os, four embedded SpaceWire clock and data recovery circuits and four high-speed serialization/deserialization (SerDes) transceivers which can be used for either external physical coding sublayer (EPCS) or Peripheral Component Interconnect Express (PCIe) protocols. They also maintain the same count of look-up tables (LUTs), flip-flops, digital signal processing (DSP) math blocks and static random-access memory (SRAM) blocks as the existing CCGA package with 1,657 pins.

About Microsemi’s RTG4 FPGAs and Development Kit
RTG4 FPGAs bring new capabilities to the market and combine a wealth of features with the highest quality and reliability to meet the increasing demands of modern satellite payloads. The devices feature reprogrammable flash configuration, making prototyping easier for customers. RTG4’s reprogrammable flash technology offers complete immunity to radiation-induced configuration upsets in the harshest radiation environments, without the configuration scrubbing required with SRAM FPGA technology. RTG4 supports space applications requiring up to 150,000 logic elements, and each includes a LUT4 and a flip-flop with built-in triple module redundancy (TMR). The devices also feature total ionizing dose (TID) beyond 100 kilorads, as well as high system performance of up to 300 MHz without single event transient (SET) mitigation.

The RTG4 Development Kit features Microsemi’s Libero SoC Design Suite, offering high productivity with its comprehensive, easy to learn, easy to adopt development tools for designing with Microsemi’s radiation-tolerant FPGAs. The suite integrates industry standard Synopsys SynplifyPro synthesis and Mentor Graphics ModelSim simulation with best-in-class constraints management, debug capabilities and secure production programming support.

RTG4 is Microsemi’s latest development in a long history of radiation-tolerant FPGAs that are found in many NASA and international space programs. For more information, visit http://www.microsemi.com/products/fpga-soc/radtolerant-fpgas/rtg4.

Microsemi Leading Space Innovation for 60 Years
With one of the industry's most comprehensive portfolios of space products, Microsemi provides radiation-tolerant FPGAs, radiation-tolerant mixed-signal integrated circuits (ICs), radiation-hardened DC-to-DC converters, precision time and frequency solutions, linear and POL hybrids, custom hybrid solutions, and radiation-hardened discretes including the broadest portfolio of JANS Class diodes and bipolar products. Microsemi is committed to supporting its products throughout the lifetime of its customer programs. The company continues to innovate and expand its portfolio, which includes its LX7730 radiation-tolerant telemetry controller IC, the new LX7720 radiation-tolerant power driver IC with rotational and position sensing, as well as its RTG4#8482; high-speed signal processing radiation-tolerant FPGA family. The RTG4's reprogrammable flash technology offers complete immunity to radiation-induced configuration upsets in the harshest radiation environments, requiring no configuration scrubbing, unlike SRAM FPGA technology. For more information about Microsemi's space products, visit http://www.microsemi.com/applications/space.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at www.microsemi.com.

Source: ChinaNewswire.com

丽丰-KY 本业克丽缇娜9月爆发 加盟店家数再传佳绩破3800 家


中国上海 2017年10月25日 /ChinaNewswire.com/ 丽丰-KY公布9月底连锁加盟店已达到3811家,2017年预定的展店目标已提早达成!因此同步带动营收表现,该公司于本月11日公告 9月单月合并营收为新台币277.5百万元(人民币60.6百万元),其中主营通路美容连锁加盟店之9月单月营收为新台币271.4百万元(人民币59.3百万元,MoM9%、YoY13%),该公司主要经营之连锁美容加盟通路,经过2016年对加盟店的整顿调整、汏弱留强后,今年来已经逐步显现其经营绩效,原本预计2017年底才能达到的展店目标,也早在第三季底提前达到,就前三季合并营收来看,该公司公告前三季累计合并营收为2261.5百万元(人民币503.5百万元),其中主营通路美容连锁加盟之前三季累计营收为新台币2188.6百万元(人民币487.3百万元),故以人民币计算主营通路营收成长之年增率为19%!

丽丰-KY本业克丽缇娜在大陆持续强力发展的态势,除既有的店家业绩亮眼外,在新店加盟的部份,新店家的单月目标亦达成90%。9月EPO系列、经典系列、植萃系列等策略产品之销售比重较上月上升24.5%,其中20周年主打的明星产品『E.P.O.洁容霜纪念版』和『梵诗玫瑰化妆水』表现抢眼,销量共占店销总业绩29%。另外,新品『铂金焕妍礼盒』作为20周年主推,自8月上市以来,单月创总业绩占比22.5%,9月再与大陆最大的门户媒体新浪时尚联合推出多位美妆博主试用评测,从外观包装、质地、吸收度、保湿度、抗氧化性、亮肤能力等方面评测均获得无数好评,影响粉丝1920万,互动话题超20万,媒体热潮同时带动线下门店『铂金焕妍礼盒』之销量持续攀高。

丽丰-KY本业克丽缇娜凭借着现有的产品优势、市场开发经验、培训资源等各项核心能力,目前正积极规划南进策略,将陆续开发东协各国之美容连锁加盟店之空白市场,期望将品牌形象推升更进一步朝向国际化发展,为往后之营运获利立下基础,为未来企业之成长力道再添生力军。






Source: Chlitina

慕亚拓展亚洲团队,任命新市场部经理




新加坡 2017年10月24日 /ChinaNewswire.com/ 新加坡 ——领先的整合媒体情报、洞察及内容营销业务的Isentia慕亚集团近日宣布任命Evelyn Kwong (江曼菁)为亚洲区市场部经理,进一步加强在区域市场的投入。该任命于2017年9月正式实施,江曼菁将领导慕亚在亚洲这一关键市场的营销推广工作。

江曼菁在过去四年于不同的科技公司负责市场传讯工作。接受任命之前她在慕亚通过客户简报、内容赞助等内部及外部营销手段,推进品牌在市场的影响力和知名度。

“我非常高兴能够继续更深入的推广Isentia品牌,向大家展示我们特有的数据情报解决方案是如何帮助显著优化客户的商务策略的。从营销的角度,我非常期待与大家分享我们最新的品牌故事,及其他基于真实情报的产品和服务。” 江曼菁表示。

Isentia 首席营销官表示:“Evelyn是慕亚在亚洲的杰出骨干, 随着我们业务在亚洲的不断增长及新产品的推广,我相信Evelyn将在推进慕亚新的品牌故事及高相关度、可操作洞察服务方面发挥重要的作用。”

关于慕亚
Isentia慕亚集团((ASX:ISD)是亚太地区领先的整合媒体情报、洞察及内容营销业务公司。在12个国家帮助超过5000多个客户解析数据获取关键洞察及优化抉择。慕亚将市场领先的媒体监测经验与深度分析相结合,帮助世界领先品牌掌控全局,先人一步。凭借创新技术及世界级的精英团队,我们的使命是帮助企业获得只有掌握真正洞察才能实现的先机。了解更多我们是如何帮助优化关键抉择,请访问www.isentia.com






Source: Isentia

从互联网金融到金融科技,“蹭热度”还是“真变革”?|“创未来”创业沙龙金融科技干货整理




中国上海 2017年10月24日 /ChinaNewswire.com/ 今年云栖大会上,蚂蚁金服正式发布全球可信身份平台ZOLOZ(蚂蚁佐罗),开放全球领先的金融级生物识别技术能力。ZOLOZ将帮助用户在数字时代解决“你是谁”的身份识别问题。前不久,支付宝在肯德基的KPRO餐厅上线刷脸支付,其背后是ZOLOZ提供的金融级人脸识别技术。

当互联网对金融行业的刺激持续消减,是科技驱动产业步入崭新的纪元。这场变革让金融行业内既弥漫着寻找方向的焦虑迷茫,也充满了撬动未来的兴奋期待。那么,金融科技究竟是什么?它何以使投资者趋之若鹜?五年后,金融业态又呈现出什么模样?近期,在中欧众创平台主办的“创未来”创业沙龙第十一场金融科技上,中欧金融学教授芮萌、金融与科技领域创业者及知名高管,为你解读金融科技的现状与未来。

什么是金融科技?

去年业界还在谈论“互联网金融”,今年已变成了“金融科技”。金融科技与金融究竟是怎样的关系?这首先要从金融科技的定义说起。

芮萌教授认为,从字面意义来看,可以简单地将金融科技理解为“科技+金融”或“金融+科技”,后者更为普遍。其中,科技主要包括云计算、人工智能、区块链、大数据等创新技术,它们与传统金融服务叠加而产生的新型金融业态,就是我们所说的金融科技。

京东金融副总裁、战略投资部负责人马骥认为,金融科技是基于金融本质,以技术为手段、数据为基础的企业服务。它不同于传统金融机构的地方主要表现在对场景和用户的理解、创新的意识和对前沿技术的投入。京东金融是一家服务金融机构的科技公司,它用数据做风控,用人工智能技术识别用户身份和行为,目前在深度学习、生物识别等技术领域已经走在世界前沿。

金融科技在中国的发展速度肉眼可见,短短几年内,第三方支付的规模就增加了74倍。这也与国内的金融大环境有关。PINTEC集团副总裁董浩表示,中国的金融业是一个“大政府小市场”的生态环境,金融机构相比国外,更多受惠于牌照红利,但缺乏下沉服务至广大个人用户的能力。正是这种背景给了创业者更多的机会,通过打造金融生态的“毛细血管”,助力金融机构通过科技能力,针对不同的用户群体进行差异化金融服务。

但是这并不代表金融科技已经完全颠覆了传统金融业。芮萌教授认为,目前1.0版的金融科技并没有改变金融的本质。金融的本质是信息和信用,它的核心竞争力在于识别风险、对风险定价。目前,即使互联网的出现改变了交易的范围、人数、金额、环境等,但仍未能解决人与人之间的信任问题。它只是销售渠道意义上的一个创新,但其产品结构和设计,与银行、保险、资本市场所提供的金融产品没有本质的区别。

因此,对金融科技来说,金融仍是不变的本质,变的是技术的革新。

金融科技如何改变金融业?

科技的优势不言而喻。平安普惠副总裁兼首席产品官倪荣庆表示,在借贷业务领域,科技可以“使风险和体验的跷跷板达到平衡”。从规避风险来说,声纹识别、人脸识别、微表情等生物技术识别能够解决身份识别问题;通过技术手段多方验证与大数据的逻辑推导,能保证客户信息的完整性、可靠性,判断出可能存在的欺诈情况。从客户体验来说,大量的数据与测试更容易找出定价和额度方面的规律,进一步细分客群,做到针对性的差异化服务。

京东金融马骥坦言,以数据为基础、技术为手段,今天的金融科技企业试图深度连接金融机构,真正深入到其核心业务流程中。

伴随着科技与传统金融服务的结合,金融科技带来的自然是金融服务的创新。芮萌教授指出,新的金融模式陆续出现,其优点在于边际成本不断降低,效率则日益提高。这样就能够服务到更多长尾的客户,去满足普通个人、家庭乃至中小企业未被满足的金融需求。

网贷之家联合创始人石鹏峰同样提到了这一点。他坦言,P2P的核心是连接——互联网极大增强了任意两点间连接的可能性,并且降低了连接的成本,从而使传统树状结构演变成了去中心化的网状结构。P2P的价值在于需求对接,能满足个人理财需求与小微企业的融资需求;在于阳光化,市场能够保留精华,去其糟粕;在于利率的市场化,让中国的实体经济、民营经济能有一个更好的融资渠道。

与传统金融机构提供的标准化产品不同,在金融科技领域,由用户需求引导供给,这就催生了场景式的金融服务。例如,蚂蚁金服就已经形成了一个新的金融生态:支付宝、余额宝、招财宝等其实是横跨支付、理财、融资、保险、证券、征信的一个综合体。而在可见的业态模式变化之外,芮萌教授认为更加重要的改变在于意识形态和精神的创新。市场的参与者将更加大众化,金融科技是一种更加民主化的、而非少数精英控制的金融模式。

金融科技的未来如何?

芮萌教授预测,在不久的将来,金融产品一定是简单化、去中介化、普惠化的。未来2.0版本的金融科技,或许将抛开传统金融需要信息、信任、中介的本质要素,进行彻底颠覆。这样的场景在保险领域已可见一斑。例如,汽车保险方面有了UBI,即驾驶行为的保险,这是基于车联网技术、大数据分析的保险应用,它的模式是前所未有的。又如P2P保险,亦即互相保险,“抗癌公社”的会员通过支付工具以及支付宝的实名认证,能够从捐助人直接触达受捐人,不再需要中介。这显然是对传统金融的颠覆式改变。

另外值得一提的就是区块链技术。它具有去中心化、去信任、非对称加密、智能的合约等特征:通过分布式的记账,形成了去中心化的数据库;它用数学的方法解决了信任问题,从而抛开中介、直接创造了信用;密码学技术保证了数据传输和访问的安全;非对称的加密,则使参与者更容易达成共识。区块链的应用场景很多,包括支付、贸易金融、数字货币、期权、债券、众筹、风控、征信等,前景可期。

金融科技VS科技金融

在芮萌教授看来,谁是蚂蚁、谁是大象,尚无定论。金融机构有垄断性的线下能力、专业的金融能力、强大的资本实力和雄厚的客户资源;而互联网企业对场景、用户的理解更精准,前沿技术的投入更大。未来格局如何,谁也无法预见。不过,现有事实是,BAT与四家银行都已签约,形成了互相借力的局面,这是或许是一个发展方向。

未来,科技金融与金融科技,二者可能将从博弈走向融合。芮萌教授强调,最终无论格局如何改变,深刻理解人的欲望和人性,敬畏金融的本质,拥抱新的技术和理念,是迷雾中不变的星光。

更多精彩

体育是一个悠久古老的行业,中国的体育市场产业化始于20世纪80年代。行至2017年,随着互联网+和移动端时代的到来、虚拟现实技术和可穿戴设备的快速发展、新兴体育项目的崛起、新一代消费者习惯的更迭、全民运动文娱消费升级等颠覆性力量交汇在一起,大量创业与投资的机会正在深刻影响着体育产业的走向。“跨界融合”是体育产业发展的鲜明特质。新的组合带来新的可能,也带来新商业模式的撞击。11月10日,中欧众创平台力邀中欧教授、体育产业与其跨界领域的创业者和投资人共聚一堂,聚焦时下备受关注的跨界案例,发掘投资与运营新模式,共话体育产业发展未来。

报名链接:http://eventcentre.ceibs.edu.cn/web/event/112214

关于中欧众创平台
中欧众创平台于2015年10月24日成立,该平台将利用中欧国际工商学院强大的教学和研究力量,开展创业教学,培养创业创新人才,为中国经济转型和上海科创中心建设服务。






Source: CEIBS

Microsemi Announces BlueSky GPS Firewall to Provide Security Against GPS Spoofing and Jamming Threats




Hong Kong, China, October 24, 2017 /ChinaNewswire.com/ - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced the recent development of a breakthrough approach to protecting critical infrastructure against GPS spoofing and jamming threats with the introduction of its BlueSky#8482; GPS Firewall. Designed to provide security protection for GPS delivered position, navigation and timing (PNT) data, the BlueSky GPS Firewall solution can be deployed in-line between any standard GPS antenna and stationary GPS receiver to provide protection against GPS signal incidents, both intentional or accidental, before they enter a GPS receiver system. In response to the growing number of GPS incidents and their potential threat to critical infrastructure, and to assist customers in rapid adoption, Microsemi is making BlueSky GPS Firewall Evaluation kits available in advance of the full production release of the solution.

The dependency on PNT is increasingly important to critical infrastructure sectors such as telecommunications, energy, transportation, emergency services, financial services and enterprise infrastructure, and is mainly provided through GPS. Published best practice documents by the Department of Homeland Security (DHS) Science and Technology Directorate (ST) describe steps that can be taken to mitigate outages and disruptions with GPS reception. In alignment with these documents, Microsemi’s new BlueSky GPS Firewall provides critical infrastructure sectors with a first line of defense against GPS threats to help build out a secure, robust and resilient PNT platform for their infrastructures.

Microsemi's BlueSky GPS Firewall filters the GPS signal in real time, removing anomalies from the GPS signal before it is consumed by the downstream GPS receiver. This creates an intelligent and secure barrier against jamming and spoofing, and prevents the GPS receiver from being impacted by such incidents. Deployment of the BlueSky GPS Firewall does not require any new cabling or alteration of the pre-existing antenna installation and is interoperable with standard GPS receivers. Additionally, the BlueSky GPS Firewall incorporates an Ethernet interface for remote management and monitoring and includes a secure web interface that any browser can use for configuration and set-up of the device.

“Worldwide critical infrastructure dependency on unprotected GPS receivers is a serious security risk. These receivers are susceptible to jamming and spoofing incidents and the industry recognizes this as an increasing threat,” said Randy Brudzinski, vice president and business unit manager of Microsemi's Frequency and Time division. “The vast number of GPS systems already in operation means a significant investment would be required if every system was to be replaced. Microsemi’s BlueSky GPS Firewall is a cost-effective and easy-to-deploy solution to protect GPS without requiring replacement of deployed GPS systems.”

The BlueSky GPS Firewall includes a broad range of data validation rules based on real, live sky GPS threats, both intentional and unintentional. Similar to network security threats, new GPS vulnerabilities are on the rise and Microsemi is continuously tracking GPS signal manipulation including spoofing threats, jamming attacks, multipath signal interference, atmospheric activity and many other issues that can create GPS signal anomalies, disruptions and outages. These advancements are incorporated into the software platform of the BlueSky GPS Firewall, which can be updated remotely using Microsemi’s TimePictra#8482; management system.

According to the GNSS Market Report, Issue 5, copyright European GNSS Agency, 2017, professional market segments such as maritime, rail, telecom/utility/enterprise, surveying, aviation, agriculture and drones which use GNSS devices to operate their infrastructures, enable billions of people globally to benefit from them on a day-to-day basis—whether by enjoying the produce of sustainable and cost-effective agriculture, by using efficiently coordinated transport networks, or by leveraging on GNSS-synchronized telecommunications networks. The total installed base of GNSS devices in these professional segments was estimated at 14.4 million units in 2015 and is expected to grow to 97.8 million units by 2025.

Product Availability
Microsemi's BlueSky GPS Firewall Evaluation Kit is available for order now with delivery beginning in November 2017. For more information, visit http://www.microsemi.com/product-directory/gps-instruments/4398-bluesky-gps-firewall-evaluation-kit or contact [email protected]

About Microsemi's Product Portfolio for Communications
Microsemi is a premier supplier of high value-add semiconductor, system and services for the enterprise, data center and telecom markets. Microsemi products enable customers to build secure, reliable and low power systems that can meet stringent requirements of next generation communication networks. Customers leverage Microsemi technologies to drive innovation in a range of applications including edge and core routers, Ethernet switches, optical transport network (OTN), wireless infrastructure including LTE-Advanced, small cells and Wi-Fi access points; access aggregation and broadband gateways including fiber/PON, G.fast and DOCSIS3.1.

Microsemi's comprehensive communications portfolio offers market-leading advancements in multiple product categories including high accuracy timing and synchronization systems, software, components and services; feature-rich Carrier Ethernet switches and PHY, power-efficient and multi-standard compliant Power-over-Ethernet (PoE) systems and components, G.hn, G.fast and xDSL line drivers; innovative voice and audio intelligence, lowest power FPGAs with highest security and single event upset (SEU) immune fabric, security portfolio of hardware and software products including state-of–the-art multi-layer encryption, sophisticated key management, secure authentication with anti-tamper and anti-cloning capabilities; 100 Gigabits optical drivers and the most integrated Wi-Fi front-end modules (FEM). For more information, visit http://www.microsemi.com/applications/communications.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California and has approximately 4,800 employees globally. Learn more at www.microsemi.com.

Source: ChinaNewswire.com

QSFP-DD MSA GROUP ANNOUNCES NEW HARDWARE SPECIFICATION




Hong Kong, China, October 24, 2017 /ChinaNewswire.com/ - The Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi Source Agreement (MSA) group has released an updated 3.0 Hardware specification for the new QSFP-DD form factor. In total, 62 companies came together in support of the QSFP-DD MSA to address the industry need for a high-density, high-speed networking solution.

Established in March 2016, the QSFP-DD MSA group accepted the challenge to meet the market demand for a next generation high-density, high-speed pluggable backwards compatible module form factor. The MSA group has succeeded in releasing a 3.0 Hardware specification with broad market support that overcomes the technical challenges of specifying a QSFP28 compatible double-density interface. The QSFP-DD specification defines mechanical, electrical, and thermal management requirements to enable multi-vendor interoperability.

QSFP-DD pluggable modules can support quadruple the bandwidth of conventional QSFP modules, allowing networking equipment to keep pace with advances in ASIC technology. Systems designed for QSFP-DD modules will be backwards compatible with existing QSFP form factors and provide increased flexibility for end users, network platform designers and integrators.

The QSFP-DD 3.0 Hardware specification defines a module and both a stacked height integrated cage/connector system and a single height cage/connector system. The MSA has redefined the scope on the QSFP form factor, the industry’s leading multi-lane pluggable form factor used across Ethernet, Fibre Channel and InfiniBand. QSFP was initially launched at 40 Gbps and 100 Gbps network applications and now QSFP-DD supports up to 400 Gbps in aggregate over an 8 x 50 Gbps electrical interface.

QSFP-DD MSA founder-promoters include Broadcom, Brocade, Cisco, Corning, Finisar, Foxconn Interconnect Technology, Huawei, Intel, Juniper Networks, Lumentum, Luxtera, Mellanox Technologies, Molex, Oclaro, and TE Connectivity.

Contributors include Acacia, ACON, Alibaba, Amphenol, Applied Optoelectronics, APRESIA Systems, Cavium, Celestica, Ciena, ColorChip, Dell EMC, Delta Products, Fujitsu Optical Components, Genesis, H3C, Hisense Broadband, Hitachi Metals, Hewlett Packard Enterprise, Innovium, Inphi, Ixia, JPC, Kaiam, LEONI, Lorom, Luxshare-ICT, MACOM, MaxLinear, MultiLane, NeoPhotonics, Nokia, Panduit, PHY-SI, Ranovus, Samtec, SENKO, Semtech, Sicoya, Siemon, Skorpios Technologies, Source Photonics, Spectra7 Microsystems, Spirent, Sumitomo Electric, US Conec, Xilinx, and Yamaichi Electronics.

The QSFP-DD form factor specification is available for free download at the QSFP-DD MSA website www.qsfp-dd.com.

About Molex:

Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive, commercial vehicle. For more information, please visit www.molex.com.

Molex Resources:

#8226; Learn more about Molex at www.molex.com
#8226; Follow us at www.twitter.com/molexconnectors
#8226; Watch our videos at www.youtube.com/molexconnectors
#8226; Connect with us at www.facebook.com/molexconnectors
#8226; Read our blog at www.connector.com

Source: ChinaNewswire.com

Nordic Semiconductor adds Embedded Studio IDE support for nRF51 and nRF52 SoC development




Hong Kong, China, October 24, 2017 /ChinaNewswire.com/ - Engineers designing nRF51 and nRF52 Series Bluetooth Low Energy SoC applications now gain free access to SEGGER’s commercial Integrated Development Environment

Ultra low power (ULP) RF specialist Nordic Semiconductor ASA announces it has signed an agreement with Hilden, Germany-based SEGGER Microcontroller GmbH Co. KG to license use of Embedded Studio. The agreement allows developers to freely use Embedded Studio to develop Nordic nRF51 and nRF52 Series Systems-on-Chip (SoCs) applications without any limitations.

Embedded Studio is a complete all-in-one Integrated Development Environment (IDE) for managing, building, testing, and deploying embedded applications. The IDE includes: A powerful Project Manager; Source Code Editor; C/C++ GNU Compiler Collection (GCC) and CLANG/ compilers; an Integrated Debugger with advanced debug information windows and direct J-Link integration; and version control features for automatic deployment of finished applications.

Nordic delivers a complete software solution for its nRF51 and nRF52 Series of SOCs but until now these have relied on the use of either commercial IDEs for development or manual set-up of open-source IDEs. The nRF5 SDK included support for the commercial Keil and IAR IDEs as well as the open-source GCC compiler. When developing with GCC, either Eclipse, a free-of-charge, open-source IDE (requiring customization to work with nRF51 and nRF52 Series) or another IDE has been required for writing code and debugging. Now, with Nordic’s licensing of Embedded Studio, developers using the nRF5 SDK gain free access to a commercial IDE with full nRF51 and nRF52 Series SoCs support.

Support for the Embedded Studio IDE has been added to the latest release of the nRF5 SDK, v14.1. All examples are now available as Embedded Studio projects to enable a fast start to development. In addition to Embedded Studio, the new nRF5 SDK offers continued support for Keil V4 and V5, IAR, and GCC projects to ensure existing users can keep developing using their preferred IDE.

“The powerful Nordic nRF microcontroller family is now complemented by the best cross-platform IDE Embedded Studio which will help software engineers to be even more efficient in their daily development processes. It is another key milestone of our exciting long-lasting cooperation with Nordic, having originally started with the J-Link OB support for the Nordic evaluation boards,” says Ivo Geilenbruegge, CEO at SEGGER.

“Adding Embedded Studio is an important step in making our solutions easier to use,” says P#229;l Kastnes, a Technical Marketing Manager with Nordic Semiconductor. "Embedded Studio includes all the features needed to develop applications on the nRF51 and nRF52 Series SoCs and features an intuitive user interface easing project starts.

“Cross-platform support was one of the key things we considered when evaluating a suitable IDEs as we have a large community developing on macOS and Linux in addition to the Windows platform. Until now there has been a limited choice of easy-to-use, free IDEs for macOS and Linux with native nRF support,” says Kastnes.

"Nordic will continue to enhance the ease-of-use of its software solutions and will keep improving its design tools offering. Embedded Studio will make getting started with nRF51 and nRF52 Series SoC easier, while existing IDEs will continue to be supported. In addition, we will include tighter integration with tools like nRF Connect for Desktop to further enhance code development and testing."

About Embedded Studio
https://www.segger.com/products/development-tools/embedded-studio/

About nRF52 Series
tinyurl.com/nRF52-Series

About nRF51 Series
tinyurl.com/nRF51

About Nordic Semiconductor ASA
tinyurl.com/NordicSemi

Source: ChinaNewswire.com

Volume production of Nordic Semiconductor nRF52810 SoC brings Bluetooth 5 to even the most cost sensitive, mass-market wireless devices




Hong Kong, China, October 23, 2017 /ChinaNewswire.com/ - In addition to Bluetooth 5, nRF52810 SoC brings over-the-air (OTA) application updating, previously a feature of Nordic's high-end nRF52 Series SoCs; an optimized Nordic S112 SoftDevice (RF protocol stack); and the latest Nordic nRF5 SDK that allows designers to get lower-cost, mass-market products to consumers with all the key benefits of the latest Bluetooth specification

Nordic Semiconductor today announces that its ‘nRF52810 Bluetooth#174; Low Energy (Bluetooth LE) System-on-Chip (SoC)’—a memory-optimized addition to Nordic’s nRF52 Series of class-leading, high-performance Bluetooth 5-certified SoCs—is now available in high volume for customers across the world. The nRF52810 rounds-out the Nordic Semiconductor nRF52 Series which includes the proven nRF52832 (with which the nRF52810 is pin-compatible) and high-end nRF52840 SoCs.

The full production volume launch of the nRF52810 SoC is accompanied by the introduction of Nordic's S112 SoftDevice (Nordic’s latest RF Bluetooth 5 (Bluetooth LE) protocol software or ‘stack’), and a new version of Nordic’s nRF5 Software Development Kit (SDK), a production-ready development tool with full peripheral driver support for the nRF52810 SoC.

The nRF52810 SoC, based on Nordic’s proven nRF52 Series architecture, has the lowest power consumption in the nRF52 Series and brings the 2Mbps higher throughput, improved coexistence, and increased broadcast capacity with advertising extensions benefits of Bluetooth 5 to the most cost-sensitive, high-volume applications. The nRF52810 SoC retains the 64MHz, 32-bit ARM#174; Cortex#174; M4 MCU of other nRF52 Series SoCs maintaining the performance demanded when employing functionality such as LE secure connections and 2Mbps data processing. In addition, the nRF52810 SoC’s Flash-based software architecture brings over-the-air (OTA) application upgrades to products previously excluded by cost constraints.

Example target applications include network-connected sensors and beacon building blocks for the IoT, low-cost wearables, low-cost wireless mice and keyboards for computers and tablets, toys, disposable medical monitoring devices, and connectivity controllers as companions to much larger MCUs.

The S112 SoftDevice is an extensively-tested, optimized, lightweight stack designed to complement the nRF52810 SoC’s 196kB Flash/24kB RAM allocation. The S112 SoftDevice occupies just 100kB, ensuring ample spare memory for a wide range of mass-market Bluetooth LE applications and robust support for OTA application software upgrades.

To optimize the performance of the nRF52810 SoC, the S112 SoftDevice is a dual peripheral/broadcaster only stack but retains the Bluetooth 5/Bluetooth LE features of: 2Mbps throughput; Privacy 1.2; LE secure connections; LE Ping; Long ATT MTU; Timeslot API enabling use with Bluetooth mesh or other proprietary protocols; and PA/LNA control function.

In line with Nordic’s strategy of ensuring development tools are available on the same day as volume SoC launch, engineers can immediately commence developing designs with the nRF52840 SoC and S112 SoftDevice using the latest version of Nordic’s nRF5 SDK. The nRF5 SDK v14.1 is a production-ready development tool with full peripheral driver support for the nRF52810 SoC. In addition, the nRF5 SDK now incorporates the capabilities of the earlier nRF5 SDK for IoT including an IPv6 over Bluetooth LE adaptation layer (6LoWPAN) and a complete Internet Protocol (IP) Suite. This capability brings native IPv6 support to nRF52810 SoC Bluetooth LE applications, enabling them to talk directly to connected ‘things’ over IP-based networks. The nRF5 SDK also includes SEGGER Microcontroller’s ‘Embedded Studio’, a complete all-in-one solution for managing, building, testing, and deploying embedded applications.

The nRF52810 is a baseline Bluetooth 5 SoC, which gains its price/performance advantage from a smaller memory allocation and slightly reduced peripheral set. The peripheral set includes ADC and analog comparator; PDM digital mic input (x1); 4-channel PWM (x1); SPI (x1); I2C (x1); UART (x1); and Quadrature Decoder (x1). The SoC integrates an ARM M4 MCU providing similar computational performance and DSP functionality to the embedded processors used in the other nRF52 Series SoCs. The nRF52810 SoC features the same 100dBm link budget 2.4GHz multiprotocol radio (Bluetooth 5/ANT/2.4 GHz proprietary) as the nRF52832 SoC, providing similar RF performance but with reduced radio energy consumption of 4.6mA respectively for Tx at 0dBm, and Rx at 1Mbps. Radio output can be boosted to a maximum of +4dBm. The SoC is available in two package variants: 6x6mm QFN32 and 5x5mm QFN16. A 2.5×2.5mm WLCSP will be available later.

The key advantages of Bluetooth 5 compared with previous versions of the standard include: 2x the on-air data bandwidth (2Mbps) compared with the Bluetooth LE implementation of Bluetooth 4.2; and 8x the broadcasting ability with advertising extensions that increase the advertising packet payload size to 251 bytes for more efficient data transfer, particularly in beacon applications.

“The nRF52810 SoC and S112 SoftDevice complement the rest of the nRF52 Series line-up and are notable for bringing Bluetooth 5 wireless connectivity to any product, no matter how modest the application,” says John Leonard, a Product Marketing Manager with Nordic Semiconductor.

“Together with the simultaneous availability of the production-grade SDK, a huge new cohort of developers will now be able to design even the simplest applications with wireless performance and features that were previously impractical,” continues Leonard. “Before the nRF52810, this cohort would have been limited to non-Bluetooth 5 devices with, at best, very limited Flash, and more likely just a small amount of ROM, restricting the complexity of the application, compromising throughput and coexistence performance, and preventing OTA application upgrades that would otherwise improve security and user-friendliness.”

nRF52810 product page
Products/nRF52810

About Nordic Semiconductor ASA
tinyurl.com/NordicSemi

Source: ChinaNewswire.com

Molex Releases USB Smart Modules to Assist Connectivity Within Vehicles




Hong Kong, China, October 16, 2017 /ChinaNewswire.com/ - Single port and dual port modules allow for fast charging in automotive and
commercial vehicles.

Molex has merged automotive-grade durability with mass availability on its line of USB Smart Charge Modules. Manufactured specifically for customers’ automotive and commercial vehicles that require a smart-charge USB module, Molex products feature state-of-the-art design to give users maximum performance. Along with their unique design, USB Smart Modules were created to fit into limited space, making them the ideal fit for a wide spectrum of vehicles, ranging from farm equipment and trains to cars, trucks and SUVs.

“USB Smart Charge Modules are a market leader by virtue because they are automotive-grade smart chargers that are available as a standard product. It is rare to find that combination,” said Shella Ali, global product manager, Molex. “These products provide a solution to our customers who need a reliable and sturdy off-the-shelf USB smart-charge module. Any automotive or commercial vehicle manufacturer in the market for an affordable, smart-charging USB module backed by years of manufacturing quality improvements and expertise will benefit from having this Molex solution.”

The USB Smart Charge Modules are available in both single port and dual port models. Outside of the number of ports, the two models are nearly identical. Each features over-voltage, over-current and short-circuit protection for safety. Both models also are equipped with a 2.4A output current, a battery operating voltage of 9 to 16V, and can operate from temperatures ranging from -40 to 85°C. Additionally, each have an automotive-grade USB and are compliant to Apple MFI.

Molex USB modules are perfect for customers looking for a safer and better performing charger within a less intrusive product. These modules have been given an automotive grade and feature a higher output current than their market competition, while taking up less front panel space in a vehicle.

For more information about USB Smart Charge Modules, please visit http://www.molex.com/link/invehiclesmartcharging.html.
#8195;
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Source: ChinaNewswire.com

Nordic’s nRF52840 multiprotocol SoC is now Thread certified and enables simultaneous Thread and Bluetooth 5 connectivity for the first time




Hong Kong, China, October 12, 2017 /ChinaNewswire.com/ - Nordic’s nRF52840 System-on-Chip (SoC) with 'Dynamic Multiprotocol' feature uniquely supports concurrent Thread and Bluetooth 5 wireless connectivity (eliminating the need to disconnect from one network before connecting with another). This capability also ensures any Thread product based on the Nordic nRF52840 SoC and Nordic nRF5 SDK for Thread is seamlessly interoperable with Bluetooth 5 devices

Nordic Semiconductor announces that its latest multiprotocol SoC, the nRF52840, which supports both Bluetooth#174; 5 (Bluetooth low energy) and IEEE 802.15.4 (the foundation of the Thread networking standard together with the OpenThread stack) is now Thread 1.1 Certified. The nRF52840 SoC passed all Thread certification tests while supporting Bluetooth 5 connectivity to a central device. The tests demonstrated the nRF52840 SoC’s capability to support applications that concurrently use Thread and Bluetooth 5 wireless networks (eliminating the need to disconnect from one network before connecting with the other).

Nordic’s nRF52840 SoC is the only multiprotocol SoC on the market that offers this concurrent Thread and Bluetooth 5 support. The capability is enabled by the SoC’s Bluetooth low energy and Thread ‘Dynamic Multiprotocol’ feature (see below) which allows simultaneous support of Nordic's S140 v5 SoftDevice (the Bluetooth low energy protocol stack for the nRF52840 SoC and part of Nordic's nRF5 Software Development Kit (SDK) for Thread) and the OpenThread RF protocol stack. OpenThread is the first open-source Thread-certified implementation of the Thread networking protocol, released by Nest Labs, and to which Nordic Semiconductor actively contributes RD expertise.

For developers, this means that any wireless sensor or product that employs a Nordic nRF52840 SoC can now not only quickly and easily gain Thread Certification, but also be interoperable with (and be commissioned, controlled, or managed by) a Bluetooth v4.0 (and later) wireless technology device, benefiting from both wireless technologies at the same time.

"In operation, the nRF52840 can effectively work as a bridge between Thread and Bluetooth 5 networks, and can communicate with, for example, both a smartphone over Bluetooth 5, and a Thread wireless sensor, enabling data to be exchanged between them without going via the Cloud," says P#228;r H#229;kansson, a Product Marketing Manager at Nordic Semiconductor.

"What's more, although this isn't a truly simultaneous connection, Nordic's RD teams have engineered the process to be so quick and seamless that developers can consider it as practically simultaneous when designing their applications. Better yet, all the 'heavy lifting' to support this connectivity is hidden within the lower-level drivers of the Nordic S140 v5 SoftDevice eliminating the need for developers to have to worry about it."

Thread was designed to create the best way to connect and control products where people live and work. The protocol includes robust security (smartphone-grade authentication and AES encryption), low power battery-friendly operation, reliability, scalability, and support for a developer-friendly IP-based (IPv6 with 6LoWPAN) mesh networking.

The non-profit Thread Group states that it is focused on making Thread the foundation for the IoT in the home and beyond by educating product developers, builders, and consumers on the unique features and benefits of Thread, while ensuring a positive experience through rigorous, meaningful product certification. Prime home IoT target applications for Thread include: home automation, appliances, access- and climate-control, safety, lighting, healthcare, and security systems.

“Nordic Semiconductor continues to be a valuable and committed contributor to OpenThread,” comments Jonathan Hui, Technical Lead and Original Architect of OpenThread at Nest. “And the expeditious path of nRF52840’s Thread certification is a testament to the benefits of OpenThread’s open-source approach, portability, and optimized footprint.”

“Nordic Semiconductor has been a long and active participant in the Thread Group and is making meaningful contributions towards helping Thread deliver on its potential,” adds Grant Erickson, President of the Thread Group. “We're very pleased to see Nordic introduce their Thread-certified nRF52840 SoC to satisfy growing demand for low-power, IP-based mesh networks such as Thread, which seamlessly connect hundreds of devices to each other, to mobile devices, and directly to the cloud, without compromising battery life.”

“We see Thread as one of the leading wireless technologies currently emerging in the home IoT space,” comments Geir Langeland, Nordic Semiconductor's Director of Sales Marketing. “That’s why we’ve decided to strategically invest our world-leading ultra-low power wireless RD expertise into contributing to the development of the OpenThread software stack while ensuring our nRF52840 multiprotocol SoC became Thread 1.1 Certified in addition to its full Bluetooth 5 certification. Home IoT product developers now have access to a powerful SoC, based on a proven architecture, that supports the most complex Bluetooth 5 and Thread IoT applications.”

About Dynamic Multiprotocol

The nRF52840 SoC supports Bluetooth low energy, IEEE 802.15.4 (Thread), and other RF software protocols. Previously, Nordic’s nRF5 SDK for Thread implemented a switching solution for multiprotocol support of Bluetooth low energy and Thread. A switched solution for such support operates by disabling the operational protocol before activating the other protocol. The technique is simple to implement but is unable to support concurrent protocol operation.

The latest release of Nordic's nRF5 SDK for Thread (version 0.10.0) addresses that downside by introducing a Dynamic Multiprotocol solution for concurrent operation of Bluetooth low energy (Nordic’s S140 v5 SoftDevice (Bluetooth low energy RF protocol stack)) and Thread (OpenThread protocol stack).

The Dynamic Multiprotocol ensures the radio hardware’s operational time is shared between the protocols – ensuring both remain connected. Transmitting and receiving data using one protocol does not interfere with the other link during concurrent support.

Nordic’s firmware automatically looks after the time-sharing between protocols. The developer is freed-up to code the Bluetooth low energy functionality of a multiprotocol application as if it was solely leveraging Bluetooth low energy, and the Thread part of the multiprotocol application in the same way.

About nRF52840
tinyurl.com/nRF52840

About nRF5 SDK for Thread
http://www.nordicsemi.com/Thread

About Thread Group
www.threadgroup.org

About OpenThread
https://openthread.io

About Nordic Semiconductor ASA
tinyurl.com/NordicSemi

Source: ChinaNewswire.com

Fujitsu Hong Kong Awarded Standing Offer Agreement to Supply IT Professional Services to the Government of HKSAR




Hong Kong, China, October 11, 2017 /ChinaNewswire.com/ - Fujitsu Hong Kong Awarded Standing Offer Agreement to Supply IT Professional Services to the Government of HKSAR

Sustaining the 4 years of support to the Government of HKSAR on IT outsourcing services as a shortlisted contractor since 2013, Fujitsu Hong Kong is proud to announce that it has entered into a Standing Offer Agreement (SOA) for Quality Professional Services 4 (SOA-QPS4) with the Government of HKSAR for another 4 years.

"We are honored to be recognized for our excellent services as one of the shortlisted contractors to serve the government, this enables us to continue our aspiration to serve the public sector," said Leo Ng, General Manager, Sales Marketing, Fujitsu Hong Kong. "We strive to support the government with our state-of-the-art technologies and team of best-in-class professionals, realizing our commitments to co-create a better society for the community in the future.”

Under the SOA-QPS4, Fujitsu will contribute to pre-implementation and independent programme/project management services (Category 1); on-going services (Category 2 – Major Service Group); and implementation and combined system development services (Category 3 – Major Service Group). The agreement period is effective for 48 months from July 31, 2017.

During its engagement with the Government of HKSAR under the previous SOA-QPS3 beginning in 2013, Fujitsu was among the top 3 service providers, having secured contracts with a cumulative value of over HK$90 million. Fujitsu Hong Kong was involved in a total of 20 projects including Network Support Services of the Office Automation System for Lands Department, System Maintenance and Support of Web-based School Administration and Management System for the Education Bureau, Data Conversion of Digital Traffic Aids Drawing for the Transport Department, among others.

Notes to editors:
1For Categories 2 and 3, IT projects are classified into Minor Group and Major Group. IT projects in the Major Group cover those with work assignment value over HK$3 million but not exceeding HK$15 million. For Categories 1 and 4, there will be no subdivision into Groups and the work assignment value shall not exceed HK$15 million.

Source: ChinaNewswire.com

New “Art in MTR” Exhibition Spreads the Message of Love Through Paintings and Photos by Talented Lady with Autism




Hong Kong, China, October 11, 2017 /ChinaNewswire.com/ - Love can overcome hurdles and break through limitations. Starting from today (11 October 2017) to 8 January 2018, customers passing through MTR Sheung Wan and Sai Wan Ho stations can enjoy 16 inspiring and touching photos and watercolour paintings by Ms Chang Man-yan. Diagnosed with autism when she was one year old, Ms Chang aims to promote love and equality, and to give hope to those with special needs through her works displayed at the “Art in MTR” exhibition entitled “Love Light Me Up”.

“Sitting still to draw is easy for most people. But it took me many years to achieve this after various treatments and training. Since then, I have discovered my interests in photography and painting. I definitely hope the public will, through the feelings I shared in my artworks, gain a deeper understanding of the challenges and feelings of those with autism,” said Ms Chang. “The unconditional love and encouragement from my parents and those who have shown their love and support, act as a shining star guiding my path,” she added.

“By showcasing Ms Chang’s passion for the arts, we hope to expose the talents of people with special needs, who deserve the respect, love, attention and opportunities as everyone else in the society,” said Ms Linda So, Corporate Affairs Director of MTR Corporation.

MTR Corporation offers space at different MTR stations for temporary art exhibitions under the “Art in MTR” programme to promote artistic talent and the public’s appreciation of art. Interested artists and organisations may call the MTR Hotline on 2881 8888 to enquire, or submit their proposals directly to the MTR Corporation.

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Source: ChinaNewswire.com